Heat transfer across material interfaces and in low-dimensional structure - Prof. Bao Hua, University of Michigan - Shanghai Jiaotong University Joint Institute
Project:  Heat transfer across material interfaces and in low-dimensional structure
Abstract:  Efficient heat dissipation becomes critical for the further development of microelectronics industry recently. For example, when the operating frequency of CPU reaches a few GHz, its typical dissipated power density goes up to 100W/cm2, which is comparable to a typical hot plate. The heat should be extracted effectively to prevent overheating of microelectronic devices. The microelectronic devices are composed of multilayers of metal, semiconductor, and insulator with nanoscle feature sizes. Heat transfer at the nanoscale can be distinctly different from that predicted by classical laws and is not fully understood. Deeper understanding of nanoscale heat transfer will help thermal management and enhance heat dissipation of these devices.
In semiconductors and insulators, heat is carried primarily by vibrations in the crystal lattice, which is known as phonons. The typical lifetime of phonon is on the order of picosecond, and the mean free path is on the order of microns. At such a time scale and length scale, it is hard to reveal the underlay physics of heat transfer through experiment methods. In Nano Energy Group, we are devoted to the understanding of nanoscale energy transport through atomic scale simulations. Currently we are focusing on the heat transfer across material interfaces and heat transfer in low-dimensional structure. Molecular dynamics simulations (using LAMMPS package) and first principles calculations (using VASP package) will be carried out on our high performance computer system “π”. The numerical data will be further analyzed to build models for nanoscale heat transfer and provide useful guidance to thermal management in microelectronics.
Research team: 
  1. Prof. Hua Bao, UM-SJTU Joint Institute, SJTU
  2. Cheng Shao, UM-SJTU Joint Institute, SJTU
  3. Han Xie, UM-SJTU Joint Institute, SJTU

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